Failure Modes and Mechanisms in Electronic Packages


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Failure Analysis and Reliability Challenges for Advanced Semiconductor Technologies | SSIA

Established seller since Seller Inventory IQ Shipped from UK. Book Description Condition: New. Seller Inventory n. Failure Modes and Mechanisms in Electronic Packages. Singh ; Puligandla Viswanadham. Publisher: Springer , This specific ISBN edition is currently not available.

View all copies of this ISBN edition:. Synopsis With the proliferation of packaging technology, failure and reliability have become serious concerns. Buy New Learn more about this copy. About AbeBooks.

Failure Modes Mechanisms Electronic Packages by Singh Viswanadham Puligandla

Other Popular Editions of the Same Title. Failures most commonly occur near the beginning failures caused by latent defects and near the ending of the lifetime of the parts failures caused by wearout , resulting in the bathtub curve graph of failure rates. A number of techniques can be considered for detecting defective parts in the lot at the earliest stage, such as burn-in, implemented for high-reliability parts. There are also failures caused by improper handling, storage, packaging, mounting, by radiation,etc.

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Please take note of our Privacy Policy and Legal Notice. The aim of this destructive test is to demonstrate that the internal materials, design, construction and assembly of EEE parts are in accordance with the applicable acquisition document. Read More. The aim of this process is to verify the conformity of the exterior of electrical, electronic and electromechanical components EEE parts with the acquisition document. The following aspect Loose particle contamination is often caused The purpose of this test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisi The cross-sectioning process provides access to the device internal structure, its materials and design.

Such components as diodes and capacitors and silicon dice are often subjected to cros This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i. Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension. Due to the key role played, they are required to have Electrothermal event refers to abnormal temperature increase leading to malfunction or catastrophic fails.


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The high temperature reached during such event activates or initiates some of the f

Failure Modes and Mechanisms in Electronic Packages Failure Modes and Mechanisms in Electronic Packages
Failure Modes and Mechanisms in Electronic Packages Failure Modes and Mechanisms in Electronic Packages
Failure Modes and Mechanisms in Electronic Packages Failure Modes and Mechanisms in Electronic Packages
Failure Modes and Mechanisms in Electronic Packages Failure Modes and Mechanisms in Electronic Packages
Failure Modes and Mechanisms in Electronic Packages Failure Modes and Mechanisms in Electronic Packages

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